In making computer chips, a 4.00-kg cylindrical ingot of ultrapure n-type doped silicon that is 5.20 inches in diameter is sliced into wafers m thick.
(a) Assuming no waste, how many wafers can be made?
(b) What is the mass of a wafer (d of Si = ; V of a cylinder = )?
(c) A key step in making p-n junctions for the chip is the chemical removal of the oxide layer on the wafer through treatment with gaseous HF. Write a balanced equation for this reaction.
(d) If 0.750% of the Si atoms are removed during the treatment in part (c), how many moles of HF is required per wafer, assuming 100% reaction yield?