A total of 10 rectangular aluminum fins \((k=\) \(203 \mathrm{~W} / \mathrm{m} \cdot \mathrm{K})\) are placed on the outside flat surface of an electronic device. Each fin is \(100 \mathrm{~mm}\) wide, \(20 \mathrm{~mm}\) high and \(4 \mathrm{~mm}\) thick. The fins are located parallel to each other at a center- tocenter distance of \(8 \mathrm{~mm}\). The temperature at the outside surface of the electronic device is \(60^{\circ} \mathrm{C}\). The air is at \(20^{\circ} \mathrm{C}\), and the heat transfer coefficient is \(100 \mathrm{~W} / \mathrm{m}^{2} \cdot \mathrm{K}\). Determine \((a)\) the rate of heat loss from the electronic device to the surrounding air and \((b)\) the fin effectiveness.

Short Answer

Expert verified
Question: Determine (a) the rate of heat loss from the device to the surrounding air, and (b) the fin effectiveness. a) The rate of heat loss from the device to the surrounding air (total heat transfer rate) can be found with the calculated values: \(Q = (100 (100 \times 10^{-3})(20 \times 10^{-3})(60-20))(10 \times 8 \times 10^{-3}) ~W\) b) The fin effectiveness can be found using the formula: \(\varepsilon = \frac{Q}{q''_u L_{fins}}\) Insert the calculated values for \(Q\) and \(q''_u L_{fins}\) to find the fin effectiveness.

Step by step solution

01

1. Calculate fin thickness and area

First, we need to calculate the fin thickness (\(t_f\)) and fin area (\(A_f\)) using the given values of fin width (100 mm), height (20 mm), and thickness (4 mm). Fin thickness, \(t_f = 4 \times 10^{-3} ~m\) (converting from mm to m) Fin area, \(A_f = (100 \times 10^{-3}) (20 \times 10^{-3}) ~m^2\) (converting from mm to m)
02

2. Calculate heat transfer rate per unit length

Now we will calculate the heat transfer rate per unit length (\(q''\)) using the heat transfer coefficient (\(h\)) and the temperature difference between the electronic device (\(T_s\)) and air (\(T_\infty\)). Equation for heat transfer rate per unit length is: \(q'' = h A_f (T_s - T_\infty)\). Plug in the known values: \(h = 100 ~W/m^2K\) \(A_f = (100 \times 10^{-3})(20 \times 10^{-3})~m^2\) \(T_s = 60^\circ C\) \(T_\infty = 20^\circ C\) \(q'' = 100 (100 \times 10^{-3})(20 \times 10^{-3})(60-20) ~W/m\)
03

3. Calculate the total heat transfer rate

To find the total heat transfer rate (\(Q\)) for all the fins, we have to multiply the heat transfer rate per unit length (\(q''\)) by the total length of the fins (\(L_{fins}\)). Since there are 10 fins and each has a center-to-center distance of 8 mm, the total length can be calculated as follows: \(L_{fins} = 10 \times 8 \times 10^{-3} ~m\) Now, we can calculate the total heat transfer rate: \(Q = q'' L_{fins} = (100 (100 \times 10^{-3})(20 \times 10^{-3})(60-20))(10 \times 8 \times 10^{-3}) ~W\)
04

4. Calculate the fin effectiveness

Finally, we will calculate the fin effectiveness (\(\varepsilon\)), which is defined as the ratio of the actual heat transfer rate of the finned surface to the heat transfer rate of an equivalent unfinned surface. First, we'll find the heat transfer rate for an unfinned surface. The unfinned surface area (\(A_u\)) is the same as a single fin area as per the given width and height. \(A_u = (100 \times 10^{-3}) (20 \times 10^{-3}) ~m^2\) Now, calculate the heat transfer rate for the unfinned surface (\(q''_u\)) with the same heat transfer coefficient and temperature difference: \(q''_u = h A_u (T_s - T_\infty) = 100 (100 \times 10^{-3})(20 \times 10^{-3})(60-20) ~W/m\) Finally, calculate the fin effectiveness: \(\varepsilon = \frac{Q}{q''_u L_{fins}}\) Plug in the calculated values for \(Q\) and \(q''_u L_{fins}\).

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Most popular questions from this chapter

Hot air is to be cooled as it is forced to flow through the tubes exposed to atmospheric air. Fins are to be added in order to enhance heat transfer. Would you recommend attaching the fins inside or outside the tubes? Why? When would you recommend attaching fins both inside and outside the tubes?

A 0.3-cm-thick, 12-cm-high, and 18-cm-long circuit board houses 80 closely spaced logic chips on one side, each dissipating \(0.04 \mathrm{~W}\). The board is impregnated with copper fillings and has an effective thermal conductivity of \(30 \mathrm{~W} / \mathrm{m} \cdot \mathrm{K}\). All the heat generated in the chips is conducted across the circuit board and is dissipated from the back side of the board to a medium at \(40^{\circ} \mathrm{C}\), with a heat transfer coefficient of \(40 \mathrm{~W} / \mathrm{m}^{2} \cdot \mathrm{K}\). (a) Determine the temperatures on the two sides of the circuit board. (b) Now a \(0.2\)-cm-thick, 12-cm-high, and 18-cmlong aluminum plate \((k=237 \mathrm{~W} / \mathrm{m} \cdot \mathrm{K})\) with 864 2-cm-long aluminum pin fins of diameter \(0.25 \mathrm{~cm}\) is attached to the back side of the circuit board with a \(0.02\)-cm-thick epoxy adhesive \((k=1.8 \mathrm{~W} / \mathrm{m} \cdot \mathrm{K})\). Determine the new temperatures on the two sides of the circuit board.

In the United States, building insulation is specified by the \(R\)-value (thermal resistance in \(\mathrm{h} \cdot \mathrm{ft}^{2} \cdot{ }^{\circ} \mathrm{F} /\) Btu units). A homeowner decides to save on the cost of heating the home by adding additional insulation in the attic. If the total \(R\)-value is increased from 15 to 25 , the homeowner can expect the heat loss through the ceiling to be reduced by (a) \(25 \%\) (b) \(40 \%\) (c) \(50 \%\) (d) \(60 \%\) (e) \(75 \%\)

What is a conduction shape factor? How is it related to the thermal resistance?

A plane brick wall \((k=0.7 \mathrm{~W} / \mathrm{m} \cdot \mathrm{K})\) is \(10 \mathrm{~cm}\) thick. The thermal resistance of this wall per unit of wall area is (a) \(0.143 \mathrm{~m}^{2} \cdot \mathrm{K} / \mathrm{W}\) (b) \(0.250 \mathrm{~m}^{2} \cdot \mathrm{K} / \mathrm{W}\) (c) \(0.327 \mathrm{~m}^{2} \cdot \mathrm{K} / \mathrm{W}\) (d) \(0.448 \mathrm{~m}^{2} \cdot \mathrm{K} / \mathrm{W}\) (e) \(0.524 \mathrm{~m}^{2} \cdot \mathrm{K} / \mathrm{W}\)

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