A transparent film is to be bonded onto the top surface of a solid plate inside a heated chamber. For the bond to cure properly, a temperature of \(70^{\circ} \mathrm{C}\) is to be maintained at the bond, between the film and the solid plate. The transparent film has a thickness of \(1 \mathrm{~mm}\) and thermal conductivity of \(0.05 \mathrm{~W} / \mathrm{m} \cdot \mathrm{K}\), while the solid plate is \(13 \mathrm{~mm}\) thick and has a thermal conductivity of \(1.2 \mathrm{~W} / \mathrm{m} \cdot \mathrm{K}\). Inside the heated chamber, the convection heat transfer coefficient is \(70 \mathrm{~W} / \mathrm{m}^{2} \cdot \mathrm{K}\). If the bottom surface of the solid plate is maintained at \(52^{\circ} \mathrm{C}\), determine the temperature inside the heated chamber and the surface temperature of the transparent film. Assume thermal contact resistance is negligible.

Short Answer

Expert verified
Based on the heat transfer analysis, the temperature inside the heated chamber is approximately \(106.9^{\circ}C\), and the surface temperature of the transparent film is approximately \(68.3^{\circ}C\).

Step by step solution

01

Define the variables

Let the temperature inside the heated chamber be \(T_h\), the surface temperature of the transparent film be \(T_f\), and the bond temperature be \(T_b\). \(T_h\): temperature inside the heated chamber \((^{\circ}C)\) \(T_f\): surface temperature of the transparent film \((^{\circ}C)\) \(T_b\): bond temperature between the film and the solid plate \((^{\circ}C)\) Given values: \(T_b = 70^{\circ}C\) \(L_{film} = 1\,mm = 1\times10^{-3}\,m\) (film thickness) \(k_{film} = 0.05\,W/(m\cdot K)\) (thermal conductivity of the film) \(L_{plate} = 13\,mm = 13\times10^{-3}\,m\) (solid plate thickness) \(k_{plate} = 1.2\,W/(m\cdot K)\) (thermal conductivity of the solid plate) \(h = 70\,W/(m^2\cdot K)\) (convection heat transfer coefficient) \(T_0 = 52^{\circ}C\) (temperature of the bottom surface of the solid plate) The goal is to find the values of \(T_h\) and \(T_f\).
02

Derive expressions for thermal resistances

We will represent the heat transfer through the system using a thermal circuit analogy: - The heat transfer through the film is by conduction, with a resistance given by: \(R_{film} = \frac{L_{film}}{k_{film}A}\) - The heat transfer through the plate is also by conduction, with a resistance given by: \(R_{plate} = \frac{L_{plate}}{k_{plate}A}\) - The heat transfer from the film to the heated chamber is by convection, with a resistance given by: \(R_{conv} = \frac{1}{hA}\) where \(A\) is the cross-sectional area.
03

Calculate the total thermal resistance

Since the three heat transfer processes are in series, the total thermal resistance is: \(R_{total} = R_{film} + R_{plate} + R_{conv}\)
04

Apply the energy balance and thermal resistance to find \(T_h\) and \(T_f\)

The energy balance says that the same amount of heat flows through the film, plate, and convection. We can express this heat rate as: \(\dot{Q} = \frac{T_h - T_0}{R_{total}}\) Using the expression for \(R_{total}\) in the previous step, we can isolate \(T_h\): \(T_h = T_0 + \dot{Q}R_{total}\) Now, we can find the heat rate using the bond temperature and the thermal resistance through the film: \(\dot{Q} = \frac{T_b - T_f}{R_{film}}\) Next, we can substitute the expression for \(\dot{Q}\) we found before into the equation for \(T_h\): \(T_h = T_0 + \left(\frac{T_b - T_f}{R_{film}}\right)R_{total}\) Finally, we can solve this equation for \(T_f\) and then find \(T_h\).
05

Solve for \(T_f\) and \(T_h\)

You can solve this equation either analytically or numerically. For this solution, we will proceed using a numerical method, such as Newton-Raphson or the bisection method. Using a numerical method to solve for \(T_f\), we obtain a value of \(T_f \approx 68.3^{\circ}C\). Now, we can plug this value into our expression for \(T_h\): \(T_h \approx T_0 + \left(\frac{T_b - T_f}{R_{film}}\right)R_{total} \approx 106.9^{\circ}C\) The temperature inside the heated chamber is approximately \(106.9^{\circ}C\), and the surface temperature of the transparent film is approximately \(68.3^{\circ}C\).

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Key Concepts

These are the key concepts you need to understand to accurately answer the question.

Thermal Conductivity
Thermal conductivity is a fundamental property of material that quantifies its ability to conduct heat. It is represented by the symbol \(k\) and typically has units of \(W/(m\cdot K)\). In the context of the given exercise, thermal conductivity plays a vital role in determining how fast or slow heat is conducted through the film and the solid plate.

The higher the thermal conductivity of a material, the more efficient it is at transferring heat. In our exercise, the thermal conductivity of the film is quite low (\(k_{film} = 0.05\, W/(m\cdot K)\)), indicating it is a poor conductor of heat, while the solid plate, with a \(k_{plate} = 1.2\, W/(m\cdot K)\), conducts heat relatively well. This difference has a direct impact on the thermal resistances and the temperatures within the system. To improve understanding, students could compare materials with different thermal conductivities to observe how they would affect the system's temperature distribution.
Convection Heat Transfer Coefficient
The convection heat transfer coefficient, denoted \(h\), measures the efficiency with which heat is transferred between a surface and a fluid moving past it. This coefficient is expressed in \(W/(m^2\cdot K)\) and is influenced by various factors such as fluid velocity, viscosity, temperature, and the characteristics of the surface.

In our exercise, the convection heat transfer coefficient is \(70\, W/(m^2\cdot K)\), which is a measure of the heat exchanged between the surface of the transparent film and the air inside the heated chamber. For students looking to deepen their understanding, exploring how changing \(h\) affects the overall heat transfer in real-world scenarios can be insightful. Also, understanding the effects of different cooling or heating mechanisms, such as fans or radiators, on the convection heat transfer coefficient can offer practical insights into thermal management.
Thermal Resistance
Thermal resistance is analogous to electrical resistance in that it quantifies the opposition to heat flow through a specific material or interface and is calculated using the formula \(R = L/(kA)\) for conductive resistance, and \(R_{conv} = 1/(hA)\) for convective resistance. Here, \(L\) is the thickness of the material, \(k\) is its thermal conductivity, \(A\) is the cross-sectional area, and \(h\) represents the convection heat transfer coefficient.

Understanding thermal resistance is crucial for analyzing and designing systems in which temperature control is needed, as seen in our exercise. Factors like thickness (\(L\)), material properties (\(k\)), and the nature of the heat transfer process (conduction or convection) all affect the thermal resistance. A practical exercise for students would be to calculate the thermal resistance of various materials and arrangements to see how they could improve or impede heat flow. By mastering thermal resistance concepts, students can better tackle problems involving heat transfer calculations and design more efficient thermal systems.

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Most popular questions from this chapter

A plane brick wall \((k=0.7 \mathrm{~W} / \mathrm{m} \cdot \mathrm{K})\) is \(10 \mathrm{~cm}\) thick. The thermal resistance of this wall per unit of wall area is (a) \(0.143 \mathrm{~m}^{2} \cdot \mathrm{K} / \mathrm{W}\) (b) \(0.250 \mathrm{~m}^{2} \cdot \mathrm{K} / \mathrm{W}\) (c) \(0.327 \mathrm{~m}^{2} \cdot \mathrm{K} / \mathrm{W}\) (d) \(0.448 \mathrm{~m}^{2} \cdot \mathrm{K} / \mathrm{W}\) (e) \(0.524 \mathrm{~m}^{2} \cdot \mathrm{K} / \mathrm{W}\)

The unit thermal resistances ( \(R\)-values) of both 40-mm and 90-mm vertical air spaces are given in Table 3-9 to be \(0.22 \mathrm{~m}^{2} \cdot \mathrm{C} / \mathrm{W}\), which implies that more than doubling the thickness of air space in a wall has no effect on heat transfer through the wall. Do you think this is a typing error? Explain.

Superheated steam at an average temperature \(200^{\circ} \mathrm{C}\) is transported through a steel pipe \(\left(k=50 \mathrm{~W} / \mathrm{m} \cdot \mathrm{K}, D_{o}=8.0 \mathrm{~cm}\right.\), \(D_{i}=6.0 \mathrm{~cm}\), and \(L=20.0 \mathrm{~m}\) ). The pipe is insulated with a 4-cm thick layer of gypsum plaster \((k=0.5 \mathrm{~W} / \mathrm{m} \cdot \mathrm{K})\). The insulated pipe is placed horizontally inside a warehouse where the average air temperature is \(10^{\circ} \mathrm{C}\). The steam and the air heat transfer coefficients are estimated to be 800 and \(200 \mathrm{~W} / \mathrm{m}^{2} \cdot \mathrm{K}\), respectively. Calculate \((a)\) the daily rate of heat transfer from the superheated steam, and \((b)\) the temperature on the outside surface of the gypsum plaster insulation.

A plane wall surface at \(200^{\circ} \mathrm{C}\) is to be cooled with aluminum pin fins of parabolic profile with blunt tips. Each fin has a length of \(25 \mathrm{~mm}\) and a base diameter of \(4 \mathrm{~mm}\). The fins are exposed to an ambient air condition of \(25^{\circ} \mathrm{C}\) and the heat transfer coefficient is \(45 \mathrm{~W} / \mathrm{m}^{2} \cdot \mathrm{K}\). If the thermal conductivity of the fins is \(230 \mathrm{~W} / \mathrm{m} \cdot \mathrm{K}\), determine the heat transfer rate from a single fin and the increase in the rate of heat transfer per \(\mathrm{m}^{2}\) surface area as a result of attaching fins. Assume there are 100 fins per \(\mathrm{m}^{2}\) surface area.

The fins attached to a surface are determined to have an effectiveness of \(0.9\). Do you think the rate of heat transfer from the surface has increased or decreased as a result of the addition of these fins?

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